The main content of on-site process management in electroplating production

1) Control the composition of each tank solution within the process formula specifications. Comply with the prescribed chemical analysis cycle.

2) Maintain the process conditions for electroplating production. Such as temperature, current density, etc.

3) Maintain good electrical contact between the cathode and anode.

4) Strict cathode and anode suspension positions.

5) Keep the plating solution clean and control impurities in the plating solution.

6) Maintain the integrity of the electroplating hanger and ensure good electrical contact between the hooks and hanging teeth.

2. Method of adding electroplating solution

The principle of adding materials should be based on "frequent addition" and "less addition".

2.1 Supplement of Solid Materials

Some organic solid materials are first dissolved in organic solvents and then slowly added to improve solubility. If directly added, it often causes the plating solution to become turbid. Ordinary solid materials can be dissolved in batches using the solution in the plating tank. Take a portion of the plating solution and slowly add the material to be added while stirring. Wait for it to settle and add the upper clear solution to the plating tank. Add the undissolved part to the plating solution and stir to dissolve. Repeat the homework until all are added. Without affecting the total volume of the plating solution, it can also be dissolved by stirring with deionized water or hot deionized water and added to the plating tank. Some solid materials are prone to forming clumps, which can affect the dissolution process. You can first mix it with a small amount of water to form a paste, and gradually dilute it to avoid the formation of lumps.